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Chip Zero extended to 2030 as Business Finland expands Finland's semiconductor ecosystem program

Written by Trang Pham | Sep 30, 2026, 1:09:34 PM

Business Finland has granted an expansion to the Chip Zero leading company (Veturi) program, carrying Finland’s semiconductor ecosystem work through 2030 under a total funding envelope of up to 20M€. The next phase sharpens the focus on ICAPS technologies and on turning Finnish research strength into industrial capability.

Chip Zero was launched in December 2022 and work began in 2023 as a four-year Business Finland leading company (Veturi) program, initiated and led by Applied Materials Finland (Picosun). The mission was deliberately ambitious: Bring together companies and research organizations from across the Finnish semiconductor ecosystem behind a shared goal of chips with zero lifetime emissions - lowering the deposition emissions of semiconductor manufacturing by 50%, and increasing the handprint of chips by double-digit percentages.

Business Finland has granted Chip Zero an expansion that extends the program to 2030, and the application behind it sets out a total funding envelope of up to 20M€ across the full period — 10M€ for the first phase from 2023 to 2026, and a further 10M€ for the 2027–2030 extension.

Business Finland is for the first time awarding additional funding to expand existing leading company projects rather than only to start new ones - a mechanism it says is directed at projects that have exceeded their targets. Chip Zero is one of five expansions announced, alongside programs led by Patria, Nokia, Valio and Mirka.

“The Chip Zero leading company program expansion enables us to take the next significant step toward solving future semiconductor challenges while strengthening Finland’s position in ICAPS technologies. By significantly increasing our research and development investments and expanding our collaboration with SMEs and research organizations, we are building a globally competitive ecosystem and accelerating the industrial adoption of next-generation semiconductor solutions.”

— Jussi Rautee, CEO of Picosun Oy

A sharper focus on ICAPS

ICAPS — IoT, Communications, Automotive, Power and Sensors — covers the chips that sense, switch, connect and convert power in the physical world, rather than those chasing the smallest transistor node. They sit inside electric vehicles and chargers, motor control electronics, industrial and environmental monitoring, and energy systems.

This is also where Finland’s existing strengths translate readily into industrial value. Thin-film deposition, materials chemistry and MEMS are established Finnish competences, and ICAPS is where better manufacturing carries a double benefit: lower emissions in making the chips, and chips that help make energy systems, mobility and industry more efficient.

The extended program organizes its work around 5 connected areas:

  • Next-generation ALD systems — Atomic layer deposition platforms built for ICAPS production needs: higher throughput and deposition rates, optimized architectures, smarter automation, more sustainable maintenance and a lower lifetime footprint.
  • Processes and chemistries — Industrial precursors, GaN and SiC interface engineering, barrier films for IoT and sensor devices, automotive reliability and film quality.
  • An ICAPS R&D Hub — Using existing Applied Materials Finland facilities for research and validation, connected to pilot networks, open innovation calls and the talent pipeline.
  • Device demonstrators — Designing, fabricating and validating ALD-enabled devices in power devices and modules, MEMS and sensors, and optical components, so that process development is proven at application level.
  • Leadership and Adoption — Governance, IP and data practices, a repeatable co-innovation pipeline, EU collaboration and clear routes to commercialization.

Building on the first phase

The expansion builds on work already running across the ecosystem. Chip Zero's first phase established a portfolio of co-innovation projects with Finnish companies and research organizations, spanning circular manufacturing, new chemistries, MEMS timing, photonics, wide band-gap power electronics and energy storage. Some are now complete; others continue into the 2030 roadmap.

The new work runs primarily through existing Applied Materials Finland facilities, with partners and new projects connecting technical development to application needs.

The next phase also provides opportunities for new projects. Chip Zero is inviting companies and research organizations to propose roadmap-linked challenges across these focus areas. Not every idea needs to begin as a full project. Open innovation calls, pilot access, and early concept reviews allow partners to test and refine ideas before committing to larger initiatives. The program also helps connect partner initiatives with European projects and funding opportunities.

Companies and research organizations interested in proposing a challenge, exploring collaboration opportunities, or joining the ecosystem are encouraged to contact the Chip Zero team

Read more Applied Materials stories on the Applied Materials Newsroom.

Read more about the Veturi program at Business Finland.